Tutorials
JTAG / boundary-scan tutorial |
JTAG / boundary scan applications |
IEEE 1149.1 related standards
JTAG / boundary-scan tutorial
Hardly any other test procedure has changed the testing grounds for manufacturers of electronic products the way In-Circuit Test did during the last 40 or so years. The reason for this triumph was that in-circuit testing is not confined to the test of the quality of the product but that it also shows the reasons for faults. Thus, the manufacturer has a tool that allows the creation of an automated quality control system. For example, if always the same faulty component were detected in a batch of boards, it would be recommendable to change the supplier. On the other hand, if the main reason for faulty boards is bad solder joints, the soldering process should be improved. Strictly speaking, one might think that the “philosopher’s stone” of Test had been found. This would be true – if it were not for the word "in-circuit". To test within a circuit is easier said than done, and it has not been possible without using bed-of-nail fixture technology. After some initial difficulties had been overcome, it was no problem to create the appropriate bed-of-nail fixture for any circuit - at least until the mid 1980s.JTAG / boundary-scan applications
IEEE 1149.1 can be utilized for a variety of test, debug, and in-system programming applications.
