Boundary Scan for non scanable partitions
Tuesday, June 30, 2015
CION-LX™ Module/FXT48A extend the Boundary Scan technology to non scanable partitions.
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With GOEPEL electronics presents a new Boundary Scan module. It offers a wide function range and dynamics for test of analog, digital and mixed signals. The module is an easy, safe and low cost solution to extend the Boundary Scan technology to non scanable partitions.
The CION-LX™ Module/FXT48A has 48 single-ended and 6 differential channels with a voltage range between 0,9V and 3,6V. Dynamic test resources such as frequency counter, event detector, arbitrary waveform generator or digitizer are available for each channel. Thereby, both static and dynamic at-speed tests are possible, allowing a significant improvement in the structural fault coverage and more flexible test strategies.
The new model is based on the ASIC CION-LX™, a JTAG controllable Mixed Signal Tester-on-Chip (ToC), developed by GOEPEL electronics. In context of the Boundary Scan software platform SYSTEM CASCON™ a comprehensive automation of the entire project development is possible with minimal effort. The CION-LX™ module can be connected to any Test Access Port (TAP) and can be cascaded to increase the number of channels.
GOEPEL electronics protects your Intellectual Property in Xilinx FPGAs
Wednesday, June 24, 2015
Xilinx AES programmer for better protection against potential attackers and theft of intellectual property from within the FPGA.
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GOEPEL electronics announces support for the Advanced Encryption Standard (AES) for the 7 Series FPGAs. The AES feature is designed for better protection against potential attackers and theft of intellectual property from within the FPGA.
The Xilinx AES programmer by GOEPEL electronics is integrated into the standard JTAG/Boundary Scan software platform SYSTEM CASCON. It allows programming of the so-called eFUSE register, including a 256bit AES key, via secure JTAG access. The On-Time Programmable eFUSE register is uniquely configured, after arming the FPGA can only accept the encoded bit streams, as the arming of the AES mechanism is an irreversible process. This results in maximum security during the authentication and encryption of your FPGA programming data, as well as once it is safely locked within the device.
Since the Xilinx AES Programmer is native part of the SYSTEM CASCON ISP tool suite the downloading of the encrypted programming data can then be executed on the same platform after the unique AES configuration has been completed.
High speed hardware with essential production line reliability and stability is provided through the use of the JTAG/Boundary Scan platform SCANFLEX. The system offers many possibilities to cover different applications, such as true parallel programming of multiple devices, 16+, and operation of the JTAG interfaces over long distances and through pin bed fixtures, with no loss of signal integrity, using differential pairs to connect to the target system(s).
Both the hardware and software fully support the all the other advanced technologies from the GOEPEL Embedded System Access platform, so that the combination of other test procedures such as Boundary Scan, Processor Emulation Test and even Bit Error Rate testing of high speed busses on the board are also possible using the same system.
GOEPEL electronics extends the VarioTAP emulation test for the Freescale QorIQ family
Friday, June 12, 2015
GOEPEL electronics extends the VarioTAP® technology for universal processor emulation for the Freescale QorIQ family. The processor is reconfigured to provide design-integrated test and programming instruments via the native debug port. A respective VarioTAP® model, as part of an extensive IP library, contains all relevant access information for the respective target processor. On this basis, users can select a processor corresponding to their design and be able to test and validate the connected hardware unit as well as program Flash memories.
The new VarioTAP® model now offers these techniques for the Freescale QorIQ family. QorIQ is a 64bit multicore SoC line, which has been developed for markets such as virtualized networks, wireless infrastructure, smart grid, automated industry, aerospace and defense. The T4240 is currently the largest representative with 12 cores integrated in a FCPBGA package with 1932 pins, not allowing direct contacting to external instruments. VarioTAP® can be utilized to provide design-integrated tools for test, hardware debug, Flash programming and design validation after chip mounting.
VarioTAP® is a technology for processor emulation developed by GOEPEL electronic. Thereby, a processor is reconfigured to provide design-integrated test and programming instruments via the native debug port. A respective VarioTAP® model, as part of an extensive IP library, contains all relevant access information for the respective target processor. On this basis users can select a processor corresponding to their design and be able to test and validate the connected hardware unit as well as program Flash memories.
Double-sided THT inspection for PCBs with and without work piece carrier
Monday, June 1, 2015
Expanding the configuration options for the AOI system THT-Line.
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GOEPEL electronics expands the configuration options for the AOI system THT-Line for double-sided inspection of THT assemblies. Besides the accumulating roller conveyor for work piece carriers now also tape transport is available, due to constantly increasing demand.
That allows, for instance, inspection of selective solder joints on assemblies which are transported without work piece carrier in the manufacturing process. Analogous to the accumulating roller, the tape transport can be used both for the actual manufacturing process in the upper area of the system as well as for the return transport in the lower area of the machine. In addition, a laser measuring system for the control of coplanarity (eg of connectors) or for height measurements on various components is available.
Up to two different and independently operating AOI modules can be integrated into a single system chassis of the THT-Line. This concerns, on the one hand, the inspection of THT components, which is typically carried out in the upper transport module before the wave soldering process. On the other hand, a completely self-sufficient operating second AOI module for THT solder joints can be used either in the lower return transport or in the upper transport system.
The combination possibilities offer numerous ways to efficiently adapt the AOI system to the company-specific manufacturing process. A worthwhile example is installing the system prior to the wave soldering oven where the THT components are inspected before the soldering process. The bottom-side of the PCB with the solder joints is inspected during the return transport in the lower stored area of the same machine.
GOEPEL electronics links inspection systems for the highest level of error detection
Friday, May 15, 2015
Linking all inspection data of automatic optical, solder paste and X-ray inspection.
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GOEPEL electronics presents PILOT Connect - the system for linking all inspection data of automatic optical, solder paste and X-ray inspection. The uniform interface centrally creates and administers the machine and operating data of the connected systems and collects all the test data in one verification and repair space. This allows a secure assessment of the errors, optimises the production process and reduces production costs.
Thanks to a uniform user interface, all the data of the testing systems of AOI, AXI and SPI are flexibly and straight-forwardly made available to the user. This ensures maximum security in the assessment of errors. In the event of any ambiguous errors a cross-system, automatic retest is possible. This allows additional data to be recorded, which help with the assessment of the errors. The optimised, long-term error detection reduces the danger of mistaken pseudo error classification caused by human error and therefore reduces the wastage of erroneous products.
Thanks to the statistical assessment of the linked inspection data the production process is monitored, assessed and consequently optimised. In this, PILOT Connect accesses CAD data across areas. This enables time-saving when using numerous inspection systems. Flexibility also guarantees the connection of various database systems: PILOT Connect can be linked to MySQL, MSSQLServer and Oracle database systems. Furthermore, connection to other MES systems is possible thanks to an interface. This ensures seamless traceability in the production process.
Generating AOI test programs with lightning speed using SmartGuide
Tuesday, May 12, 2015
Ease of use in the form of an app.
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AOI test program generation as easy as handling a smartphone: PILOT 6, the inspection software associated with AOI systems from GOEPEL electronics, contains SmartGuide, a simple operating concept in the style of touch screen navigation. With SmartGuide, test programs can be created quickly, accurately and comfortably – even without AOI programming skills.
SmartGuide is part of the AOI software PILOT 6 and was developed in-house. The main focus of the development was on the optimization of internal structures in order to offer the user a fluid and easy to understand programming process. Three-dimensional visualization of components and comfortable viewing functions provide outstanding illustration and thereby simplify working with the system.
The new PILOT 6 operating system guides the user from data import at production start to completion of the test program via touch screen and is especially aimed at untrained operators.
The AOI system software also features advanced 3D measurement functions. In addition to position, height and coplanarity of components, even solder volume, wetting surface and wetting height of solder joints can be reliably measured. These test functions are made possible by the measurement module 3D•EyeZ, which can be optionally integrated into the in-line AOI system AdvancedLine and the stand-alone AOI system BasicLine.
Highly precise and fast inspection of solder and sinter pastes
Thursday, May 7, 2015
At the SMT/Hybrid/Packaging show in Nuremberg GOEPEL electronics will present a new-generation solder paste inspection system. The SPI-Line 3D allows solder pastes and sinter pastes with a height of less than 50 µm to be measured precisely and quickly. The newly developed measuring head, with double-sided projection within the device, provides the maximum degree of repeatability and reliability through its shadow-free inspection. The speed-optimized camera head keeps pace with the high production throughput without any loss of precision: 180 pictures per second up to 290 cm²/s means uncompromisingly high-speed solder paste inspections. The SPI-Pilot system software gives the user the easiest and most intuitive test program creation experience. It can be operated via a touchscreen and enables programming to be done in less than 10 minutes. The new SPI-Line 3D has also been fundamentally modified mechanically: The 3D measuring head moves through wear-free linear axes with the highest dynamics. The SPI-Line 3D has recently added the single networking system for all inspection data from AOI, SPI and AXI by linking through PILOT Connect. This common interface centrally records and manages the machine and operating data from the linked systems. All test information can be then be brought together at one verification and repair station, where secure error evaluation and brand new possibilities for optimizing the production process can be established.
At the SMT/Hybrid/Packaging show in Nuremberg GOEPEL electronics will present a new-generation solder paste inspection system. The SPI-Line 3D allows solder pastes and sinter pastes with a height of less than 50 µm to be measured precisely and quickly. The newly developed measuring head, with double-sided projection within the device, provides the maximum degree of repeatability and reliability through its shadow-free inspection.
The speed-optimized camera head keeps pace with the high production throughput without any loss of precision: 180 pictures per second up to 290 cm²/s means uncompromisingly high-speed solder paste inspections. The SPI-Pilot system software gives the user the easiest and most intuitive test program creation experience. It can be operated via a touchscreen and enables programming to be done in less than 10 minutes. The new SPI-Line 3D has also been fundamentally modified mechanically: The 3D measuring head moves through wear-free linear axes with the highest dynamics.
The SPI-Line 3D has recently added the single networking system for all inspection data from AOI, SPI and AXI by linking through PILOT Connect. This common interface centrally records and manages the machine and operating data from the linked systems. All test information can be then be brought together at one verification and repair station, where secure error evaluation and brand new possibilities for optimizing the production process can be established.
Three-dimensional inspection for small-batch production
Tuesday, April 28, 2015
3D measurement module for stand-alone AOI system.
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GOEPEL electronics will showcase a stand-alone AOI system with 3D measurement module for the first time at this year's SMT show in Nuremberg. With the , shadow-free, three-dimensional inspection of printed circuit boards in small and medium-sized batches is now possible too. Thanks to the innovative measurement technology, the AOI system with manual loading is given an enhancement to the orthogonal camera and rotating angled-view module.
For manufacturers with lower batch sizes, the BasicLine·3D provides a powerful and flexible system that can be configured according to the individual production situations and inspection requirements.
The 3D•EyeZ sensor module is based on a Telecentric Multi Spot Array (TMSA), which measures the height of assemblies and solder joints using a scanning process. Due to the orthogonal and telecentric projection and viewing direction, it is even possible to measure accurately in the gaps between the closest of components. This technology also ensures that the surface properties of the assembly remain independent.
Thanks to the extended scope of testing, it is now also possible to measure solder volumes and the wetting surface of solder joints, as well as the height and coplanarity of components. These features are also included in the new AOI software PILOT 6. It is characterised in particular by fast and convenient creation of test programs. The integrated SmartGuide is a touchscreen operating concept in the style of an app and is also easy to use, even for inexperienced users.
Test technology highlights at the SMT/Hybrid/Packaging 2015
Friday, April 17, 2015
GOEPEL electronics will present highlights of optical/X-Ray inspection and JTAG/Boundary Scan from May 5 to 7 at booth 111 in hall 7a.
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At this year’s SMT/Hybrid/Packaging show in Nuremberg, GOEPEL electronics will present highlights of optical/X-Ray inspection and JTAG/Boundary Scan. From May 5 to 7 at booth 111 in hall 7a, visitors can learn how electronic manufacturing can be optimized, errors can be minimized and production costs can be decreased through significant innovations that can be expected this year.
The AOI software system “PILOT 6” will be presented with major advancements. It is characterized by comfortable and fast test program generation in app style – especially valuable for inexperienced users.
Launched for the first time will be “PILOT Connect”, the system that links all inspection data for automated optical, solder paste and X-ray inspection. This unique interface collects and centrally manages the machine and operating data of the connected systems and merges all test data onto one repair and verification station.
The exhibited optical inspection systems by GOEPEL electronics satisfy all customer requirements – whether as a stand-alone system (BasicLine), high-end inline system (TurboLine) or as the world’s only 3D AOI system with telecentric measurement technology (AdvancedLine·3D).
Comprehensive high speed X-ray inspection will be provided by the inline 3D AXI system X-Line 3D. AXI+AOI=AXOI, is the formula behind a combined AXI/AOI system that provides the ability to see past the surface, beyond the “tip of the iceberg” and into the hidden details so often critical for ultimate product quality.
The entirely new solder paste inspection system SPI-Line 3D offers maximum flexibility at maximum speed. Due to the large z-axis range, even the smallest feature sizes, such as with sintering paste, can be accurately measured.
The GOEPEL electronics business unit, JTAG/Boundary Scan, completes the formula for highest error and test coverage. The brand new ChipVORX module FXT-X32/HSIO4 allows testing of high-speed bus systems such as USB 3.0, PCIe and eSATA. The CION-LX Module FXT96 is the latest generation module for testing analog, digital and mixed signals applications, using the world’s first JTAG controllable Tester on Chip (ToC), called CION LX.
Electrical testing, programming, validation and emulation are all possible with JULIET, GOEPEL electronic’s desktop system for prototyping and production. Also, the inline Boundary Scan based “in-system programmer”, RAPIDO, keeps pace with the highest production rate, keeping up with the cycle time of the production line.
I/O module enhances testability of assemblies
Wednesday, April 15, 2015
A next generation mixed signal I/O module.
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GOEPEL electronics continues to add new and innovative products to the JTAG/Boundary Scan hardware platform SCANFLEX with the SFX-5296LX, a next generation mixed signal I/O module. It offers a powerful solution to make even non-scannable partitions testable through boundary scan. This, for example, allows testing of assemblies with just one Boundary Scan IC.
The SFX-5296LX is equipped with diverse dynamic test resources for each channel, such as a frequency counter, an event detector, an arbitrary waveform generator and digitizer. With a total of 96 single ended channels the Boundary Scan test can be extended to non-scannable components such as connectors, clusters or analog interfaces. To increase flexibility, each channel can be configured as input, output and tri-state and can be easily programmed using many available parameters. These include switchable pull up/pull down or selectable slope steepness for the driver.
The new SFX-5296LX uses the parallel I/O bus and therefore enables much faster data transfer than with serial, via TAP driven I/O modules. Based on the test resources available per channel, both static and dynamic at-speed tests are feasible, allowing a significant improvement of the structural fault coverage along with more flexible test strategies. Thereby only one SFX slot is needed. To increase the number of channels, several modules can be operated simultaneously.
The module is based on the ASIC CION-LX, a multifunctional mixed signal tester on chip (ToC) developed by GOEPEL electronics. The Boundary Scan software SYSTEM CASCON allows full automation of the entire project development, from integration of the module into the tester configuration, to automatic test generation and automatic error diagnosis.