Medical electronics applications carry some of the highest product quality and reliability requirements in the industry, with lives often depending on it. Coupled with high performance electronic technologies, extremely dense board layouts and stringent requirements for very detailed documentation and proof of fault coverage and testability, engineers need the most innovative test tools and methodologies available.
JTAG/boundary scan and Optical/X-Ray inspection techniques can detect faults associated with difficult to access test points in board designs that are too dense to be probed and under components such as BGAs where probes cannot reach. AOI and AXI inspection can detect faults that are not electrically detectable including cracks or voids in solder joints that may function at the time of test but fail later in the field as well as misplaced, missing or incorrectly oriented components. Detection of these types of faults is beyond the capability of traditional bed-of-nails or flying probe based in-circuit test and often critical for maximizing fault coverage. Combining JTAG/boundary scan based test tools and methodologies can greatly enhance fault coverage and automated optical (AOI) or 3D X-Ray (AXI) inspection represents the ultimate in detection for elusive faults that cannot be detected electrically.
- Enhanced fault coverage for high density assemblies and challenging component types.
- Fault coverage analysis with detailed documentation.
- Embedded solutions for test applications such as high speed interfaces and in-system programming.
- AOI and 3D AXI can locate faults that are not electrically detectable.