GOEPEL's OptiCon series is a family of automated optical inspection (AOI) systems for a wide variety of applications and requirements.
In addition to automated optical and x-ray inspection systems, GOEPEL offers high-speed 3D solder paste inspection systems.
OptiCon SPI-Line 3D enables precise three-dimensional solder paste printing measurement in terms of height, volume, offset and smearing.
GOEPEL's OptiCon X-Line 3D enables reliable, high-speed inline 3-D Automated X-Ray Inspection of double-sided PCB assemblies. Real-time, multi angle image recording is the basis for a test speed of 40cm²/s for full 3D PCB capturing.