Test and Inspection Solutions for Telecommunication and Networking Electronics
We all expect our phones to work flawlessly and the "internet to be on" all the time, day in and day out, with virtually no downtime.
The complexity of communication and networking systems can be mind boggling. Our hunger for better voice quality, video communication,
wireless and wired network connections with higher speed seems to be limitless. Combined with the exponentially growing amount of data
to be stored and transported, this means that communication and networking systems need to constantly grow and advance.
Designers need to keep the same form factor or even reduce size and power requirements of these electronics, despite their constantly growing complexity.
Telecommunication and networking electronics are among the most complex printed circuit board assemblies, with very high component density and the latest packaging technologies for integrated circuits.
Manufacturing and test engineers need to be able to count on test and inspection systems
and methodologies that can detect and locate manufacturing defects such as bad solder joints,
even elusive cracks or voids in solder joints, misplaced, missing or incorrectly oriented components,
including defects hidden by packaging or other board elements. This can often be beyond the capability
of bed-of-nail fixture or flying probe based in-circuit test, resulting in additional test approaches
being combined with in-circuit test, possibly including optical or X-Ray inspection, to fulfill the requirements.
GOEPEL Electronics' test and inspection products and services offer comprehensive solutions to these and other challenges:
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JTAG / boundary scan solutions, |
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Automated Optical Inspection (AOI), |
